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dc.contributor.authorKeskenler, Eyüp Fahri
dc.contributor.authorKeskenler, Mustafa Furkan
dc.contributor.authorTomakin, Murat
dc.contributor.authorNevruzoğlu, Vagif
dc.date.accessioned2020-12-19T19:40:34Z
dc.date.available2020-12-19T19:40:34Z
dc.date.issued2019
dc.identifier.citationKeskenler, E.F., Keskenler, M.F., Tomakin, M. & Nevruzoğlu, V. (2019). Fabrication and characterization of Au/n-ZnO/p-Si/Al sandwich device with Sol-gel spin coating method. Journal of Materials Science-Materials in Electronics, 30(6), 6082-6087. https://doi.org/10.1007/s10854-019-00909-wen_US
dc.identifier.issn0957-4522
dc.identifier.issn1573-482X
dc.identifier.urihttps://doi.org/10.1007/s10854-019-00909-w
dc.identifier.urihttps://hdl.handle.net/11436/1578
dc.descriptionWOS: 000462481400079en_US
dc.description.abstractZnO thin films with the n-type properties were obtained on the p-Si substrates for multi-layered sandwich device depositing by sol-gel method. Au and Al were conducted on two side of hetero-junction by PVD technique. From X-ray diffraction pattern, a strong (002) direction is observed, which means the film is hexagonal texture. Cross-section image from the scanning electron microscope demonstrated that the coated ZnO films had similar to 427nm thickness. Electrical behavior of the device was characterized by applying voltage versus current. High purity Au and Al metals were vacuum evaporated to make Schottky and Ohmic contacts onto the device. Au/n-ZnO/p-Si/Al architecture exhibited a rectification behavior. According to Thermionic emission mechanism theory, barrier height and ideality factor of device were found as 1.4 and 0.54eV, respectively. the series resistance values were obtained from dV/d(lnI) versus I and H(I) versus I graphs as 43.6 and 229.9 , respectively.en_US
dc.language.isoengen_US
dc.publisherSpringeren_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.titleFabrication and characterization of Au/n-ZnO/p-Si/Al sandwich device with Sol-gel spin coating methoden_US
dc.typearticleen_US
dc.contributor.departmentRTEÜ, Mühendislik ve Mimarlık Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.contributor.institutionauthorKeskenler, Eyüp Fahri
dc.contributor.institutionauthorTomakin, Murat
dc.contributor.institutionauthorNevruzoğlu, Vagif
dc.identifier.doi10.1007/s10854-019-00909-w
dc.identifier.volume30en_US
dc.identifier.issue6en_US
dc.identifier.startpage6082en_US
dc.identifier.endpage6087en_US
dc.relation.journalJournal of Materials Science-Materials in Electronicsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US


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