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dc.contributor.authorChen, Shun-man
dc.contributor.authorYılmaz, Erol
dc.contributor.authorWang, Wei
dc.contributor.authorWang, Yi-ming
dc.date.accessioned2022-11-24T08:21:11Z
dc.date.available2022-11-24T08:21:11Z
dc.date.issued2022en_US
dc.identifier.citationChen, S.M., Yilmaz, E., Wang, W. & Wang, Y. (2022). Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills. Construction and Building Materials, 360, 129601. https://doi.org/10.1016/j.conbuildmat.2022.129601en_US
dc.identifier.issn0950-0618
dc.identifier.issn1879-0526
dc.identifier.urihttps://doi.org/10.1016/j.conbuildmat.2022.129601
dc.identifier.urihttps://hdl.handle.net/11436/7144
dc.description.abstractCementitious tailings backfill (CTB) is a regularly used technique for most mines at home and aboard since it has a significant meaning for the recycling of total tailings and enhances the safety of underground mines. Thus, studying the behavior of the CTB materials exposed to diverse curing stresses is fairly vital to guarantee the whole stability and long-term ageing of underground mining structures. This paper inspects the effect of diverse curing stresses (0 kPa - witness, 180 kPa, 360 kPa and 540 kPa) on physico-mechanical characteristics of CTB materials subjected to a curing age of up to 28 days. Based on lab tests, uniaxial compression and microstructure analyses are performed for all the specimens. To well characterize the self-desiccation behavior of CTB speci-mens, suction and electrical conductivity are also scrutinized during their curing processes. Results indicate that curing of CTBs under stress ranging from 0 to 540 kPa can improve their strength gains to some extent. Irre-spective of curing stress, CTB's suction is enlarged while its porosity is dropped once increased with curing age and stress, respectively. There exists a robust power function between suction and strength while there is a linear link between electrical conductivity and strength. One can state from this study that curing stress must be significantly taken into account during the backfill mixture proportions' design.en_US
dc.description.sponsorshipNational Natural Science Foundation of China (NSFC) Foundation for Young Scientists of Hebei Education committee :52204148 QN2022023en_US
dc.language.isoengen_US
dc.publisherElsevieren_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectCementitious backfillen_US
dc.subjectCuring stressen_US
dc.subjectPore structureen_US
dc.subjectMatrix suctionen_US
dc.subjectElectrical conductivityen_US
dc.titleCuring stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfillsen_US
dc.typearticleen_US
dc.contributor.departmentRTEÜ, Mühendislik ve Mimarlık Fakültesi, İnşaat Mühendisliği Bölümüen_US
dc.contributor.institutionauthorYılmaz, Erol
dc.identifier.doi10.1016/j.conbuildmat.2022.129601en_US
dc.identifier.volume360en_US
dc.identifier.startpage129601en_US
dc.relation.journalConstruction and Building Materialsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US


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